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Ingot and Wafer Making

This is the very first part of semiconductor manufacturing. It is the fabrication of the substrates on (and into) which the semiconductor devices will be fabricated. The most common substrate material to date is silicon. Poly silicon is melted and then a single crystal ingot is drawn from the molten silicon. This ingot is thin sliced into thin wafers. The wafers are ground and polished into precision disks.

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